Kontakt
Ako nakupovať
Doručenie
Nákupný poradca
Angličtina
594 b
Až 30 dní na vrátenie tovaru
Zákazníci tiež kúpili
Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.
Informácie o knihe
Angličtina
Kategórie
Darujte túto knihu ešte dnes
Je to jednoduché
1 Pridajte knihu do košíka a vyberte možnosť doručiť ako darček 2 Obratom Vám zašleme poukaz 3 Knihu zašleme na adresu obdarovanéhoMohlo by vás tiež zaujímať
/
Brožovaná
13.24
€
/
Brožovaná
9.80
€
/
Brožovaná
12.53
€
Ahoj! Som Libroamiko, tvoj knižný radca.
Ako ti môžem pomôcť?